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Power Management - Specialized
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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LTC3589EUJ#TRPBFIC DC/DC CONV 8-OUTPUT 40QFN |
0 |
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Datasheet | - | 40-WFQFN Exposed Pad | Tape & Reel (TR) | Active | Handheld/Mobile Devices, OMAP™ | 8µA | 2.7V ~ 5.5V | -40°C ~ 125°C | - | - | Surface Mount | 40-QFN (6x6) |
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LTC3589EUJ-1#TRPBFIC CONV DC/DC 8-OUTPUT 40QFN |
0 |
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Datasheet | - | 40-WFQFN Exposed Pad | Tape & Reel (TR) | Active | Handheld/Mobile Devices, OMAP™ | 8µA | 2.7V ~ 5.5V | -40°C ~ 125°C | - | - | Surface Mount | 40-QFN (6x6) |
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TWL6032A1B0YFFRIC POWER/BATT MGMT 155DSBGA |
0 |
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Datasheet | - | 155-UFBGA, DSBGA | Tape & Reel (TR) | Obsolete | Handheld/Mobile Devices, OMAP™ | 20µA | 2.5V ~ 4.8V | -40°C ~ 85°C | - | - | Surface Mount | 155-DSBGA (5.21x5.36) |
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MC35FS4503CAER2SYSTEM BASIS CHIP, LINEAR 0.5A V |
0 |
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Datasheet | - | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MWCT2013AVLHNEVIS3A_WCT,64LQFP |
0 |
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Datasheet | - | 64-LQFP | Tray | Active | Wireless Power Transmitter | - | - | - | - | - | Surface Mount | 64-LQFP (10x10) |
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MC35FS6503CAER2FS6500 |
0 |
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Datasheet | - | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6600M0ESR2SAFETY SBC FOR S32S2 MCU |
0 |
|
- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Safety | - | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33FS6600M1ESR2SAFETY SBC FOR S32S2 MCU |
0 |
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- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Safety | - | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33FS6600M2ESR2SAFETY SBC FOR S32S2 MCU |
0 |
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- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Safety | - | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200CXESIC POWER MANAGEMENT LS1043A |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200D2ESIC POWER MANAGEMENT |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DBESIC POWER MANAGEMENT I.MX8QM |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DFESI.MX8QXP WITH DDR3L |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DHESIC POWER MANAGEMENT I.MX8QM |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200ESESIC POWER MANAGEMENT I.MX8QM |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200ETESIC POWER MANAGEMENT I.MX8QM |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DMESPOWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DNESPOWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200EMESPOWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33FS6600M2KSR2SAFETY POWER MANAGEMENT IC, QFN5 |
0 |
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- |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | - | - | 2.7V ~ 60V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
