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Power Management - Specialized
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MC33PF8100CHESIC POWER MANAGEMENT I.MX8QM |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
MC33PF8100EAESIC POWER MANAGEMENT LS1046A |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
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MC33PF8100ERESIC POWER MANAGEMENT I.MX8QM |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tray | Active | High Performance i.MX 8, S32x Processor Based | - | 2.7V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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LM2984T/NOPBIC CONV MICROPROCESSOR TO220-11 |
0 |
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Datasheet | - | TO-220-11 Formed Leads | Tube | Obsolete | Power Supplies | 100mA | 6V ~ 26V | -40°C ~ 125°C | - | - | Through Hole | TO-220-11 |
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MC35FS4503NAER2FS4500 |
0 |
|
Datasheet | - | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
MC33FS8435G0ESR2SAFETY POWER MANAGEMENT IC, QFN5 |
0 |
|
Datasheet | - | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33FS8435G0KSR2SAFETY POWER MANAGEMENT IC, QFN5 |
0 |
|
Datasheet | - | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
|
MC35FS6512NAEFS6500 |
0 |
|
Datasheet | - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
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MC35FS4507CAESYSTEM BASIS CHIP, LINEAR 0.5A V |
0 |
|
Datasheet | - | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
|
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MC33FS8430G2ESSYSTEM BASIS CHIP FS8430 |
0 |
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- |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
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MC33FS8430G4ESSYSTEM BASIS CHIP FS8430 |
0 |
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- |
* | - | Tray | Active | - | - | - | - | - | - | - | - |
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MC33PF8200DEESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Datasheet | - | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
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MC33PF8200D2ESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Datasheet | - | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
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MC33PF8200DBESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Datasheet | - | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200EMESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Datasheet | - | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200ETESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
|
Datasheet | - | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
|
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MC33PF8200DNESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DMESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33PF8200DFESR2POWER MANAGEMENT IC I.MX8 PRE-PR |
0 |
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Datasheet | - | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8, S32x Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
